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32857 Parchem Technical Data Compendium 2015_Crop4emag.pdf

CONTENTS CONCRETE REPAIR CORROSION CONTROL GROUTS & ANCHORS PROTECTIVE COATINGS INDUSTRIAL FLOORING SURFACE TREATMENTS JOINT SEALANTS CONCRETE JOINTING JOINT FILLERS WATERPROOFING WATERSTOPS ROOFING TIMBER FLOORING ALPHABETICAL INDEX 387 Prepare a suitable width of substrate slightly wider than the membrane width selected. Sharp arises should be ground down pencil round. Remove all dirt, dust and laitance by rigorous wire brushing, grit blasting or grinding. Any spalling or honeycombing must be repaired using Nitomortar AP resin mortar and allowed to harden prior to the application of the Emer-Band system. If the concrete is wetter than Saturated Surface Dry (SSD), dry it gently with a gas torch or hot air blower. If required, a maximum 25 mm width of bond breaker tape applied adjacent to either areas will provide an increased unbonded width and greater movement potential if required. Priming For most concrete applications use of a primer is unnecessary, however in cases where Emer-Band is being used on other substrates i.e. steel, fired clay bricks etc, a primer may be required. Please call your local Parchem sales office for further information. Welding Emer-Band can be jointed by hot air welding to cater for any joint length. A electric hot air gun of the type used by vinyl flooring applicators is generally suitable for the task. The hot air gun should have a nozzle with a slot shaped outlet to spread the hot air across a broad fan. This will allow for more effective bonding and prevent localised over heating and charring of the Emer-Band tape. Before bonding, solvent wipe the two faces to be bonded with Solvent 10 and create an overlap of at least 40 mm. The ambient air temperature should be taken into account when welding by adjusting the welding speed to ensure that the Hypalon is neither scorched or under-heated with no weld forming. Solvent welding of the Hypalon tape is an alternative to hot air welding, however solvent welding is slower because of the time required for the solvent to soften the tape to allow welding. If required Solvent 10 can be used as a welding solvent. Preparation of the membrane This operation is vital to the adhesion and performance of the Emer-Band system. When all substrate preparation has been carried out and the joints are ready for application of the Emer-Band, measure and cut the length of Emer-Band to suit the joint. Carry out any welding of the Emer-Band tape as required to cater for the length of joint to be bonded during this application session. Lay the Emer-Band with the bond face up on a clean surface. Solvent wipe the bond face of the Emer-Band with Solvent 10 to activate the Hypalon for bonding. The solvent wipe is essential in order to achieve adequate adhesion (refer section on Welding). Mixing and application of the adhesive Nitomortar AP is a two part epoxy resin based adhesive designed for maximum bond strength with the Emer-Band Tape and is tolerant of damp concrete substrates. Transfer the entire contents of the hardener component into the base component can and mix thoroughly using a slow speed drill and spiral stirrer for a full 4 minutes stopping occasionally to scrape the sides of the tub. Mixing is complete when a uniform colour is achieved. Apply the adhesive onto the substrate using a spreader, making sure that an even spread of adhesive approximately 2 mm thick is applied to an area wider that the Emer-Band tape. Once this has been done lay the solvent wiped, bond face of the Emer-Band tape onto the adhesive and align as required pressing it firmly over its full area ensuring complete contact. Finish along each edge of the Emer-Band tape with a small triangular fillet of adhesive and remove any excess. Membrane should be applied no more than 20 minutes after wiping the bond face of the Emer-Band tape with Solvent 10. If the Emer-Band tape cannot be placed in contact with the adhesive within 20 minutes of solvent wiping, it should be wiped again with Solvent 10 immediately prior to placement. Allow the Nitomortar AP to cure for 3 to 48 hours before applying a layer of Nitomortar AP along the edges of the top surface of the Hypalon tape. Application of the adhesive serves to encapsulate the edges as shown in the diagrams on page 2. Immediately after application of the adhesive to the top face of the Hypalon tape, peel the green tape from the centre of the Hypalon to produce an even straight sided epoxy fairing with no epoxy bridging the joint. Limitations Joint layouts incorporating Emer-Band to be kept as simple as possible to allow for site joints to be restricted to straight butt joints. Avoid complex changes of angle or skew giving rise to difficulty in jointing and installation. Emer-Band


32857 Parchem Technical Data Compendium 2015_Crop4emag.pdf
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